Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
Info:
Journal of Vacuum Science & Technology A 30, 01A103 (2012)
Author Information
Films
Film/Plasma Properties
Analysis: TEM, Transmission Electron Microscope
Analysis: XRR, X-Ray Reflectivity
Analysis: XRD, X-Ray Diffraction
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Analysis: Four-point Probe
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Analysis: RBS, Rutherford Backscattering Spectrometry
Analysis: AFM, Atomic Force Microscopy
Substrates
Notes