Low temperature thin film transistors with hollow cathode plasma-assisted atomic layer deposition based GaN channels
Type:
Journal
Info:
Applied Physics Letters 104, 243505 (2014)
Date:
2014-06-04
Author Information
Name | Institution |
---|---|
S. Bolat | Bilkent University |
Çağla Özgit | Bilkent University |
Burak Tekcan | Bilkent University |
Necmi Biyikli | Bilkent University |
Ali Kemal Okyay | Bilkent University |
Films
Plasma GaN
Thermal Al2O3
Film/Plasma Properties
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Transistor Characteristics
Analysis: -
Substrates
Silicon |
Notes
Substrates RCA cleaned followed by HF-dip prior to deposition. |
Meaglow Ltd hollow cathode RF-plasma source was used. |
139 |