Comparison of chemical stability and corrosion resistance of group IV metal oxide films formed by thermal and plasma-enhanced atomic layer deposition
Type:
Journal
Info:
Scientific Reports 9, Article number: 10438 (2019)
Date:
2019-07-18
Author Information
Name | Institution |
---|---|
Min Li | Nanjing University |
Zhi-Xian Jin | Nanjing University |
Wei Zhang | Nanjing University |
Yu-Hang Bai | Nanjing University |
Yanqiang Cao | Nanjing University |
Wei-Ming Li | Nanjing University |
Di Wu | Nanjing University |
Aidong Li | Nanjing University |
Films
Thermal TiO2
Plasma TiO2
Thermal ZrO2
Plasma ZrO2
Thermal HfO2
Plasma HfO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Electrochemical Performance
Analysis: EIS, Electrochemical Impedance Spectroscopy
Characteristic: Electrochemical Performance
Analysis: Linear Sweep Voltammetry
Substrates
Si(100) |
Notes
1660 |