Comparison of chemical stability and corrosion resistance of group IV metal oxide films formed by thermal and plasma-enhanced atomic layer deposition

Type:
Journal
Info:
Scientific Reports 9, Article number: 10438 (2019)
Date:
2019-07-18

Author Information

Name Institution
Min LiNanjing University
Zhi-Xian JinNanjing University
Wei ZhangNanjing University
Yu-Hang BaiNanjing University
Yanqiang CaoNanjing University
Wei-Ming LiNanjing University
Di WuNanjing University
Aidong LiNanjing University

Films

Thermal TiO2


Plasma TiO2






Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Electrochemical Performance
Analysis: EIS, Electrochemical Impedance Spectroscopy

Characteristic: Electrochemical Performance
Analysis: Linear Sweep Voltammetry

Substrates

Si(100)

Notes

1660