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TaNx Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing TaNx films returned 37 record(s).

NumberTitle
1Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
2Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
3Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
4Ru thin film grown on TaN by plasma enhanced atomic layer deposition
5Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
6The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
7Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
8Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
9Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
10Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
11High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
12A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
13Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
14Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
15Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
16High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
17Electrical and structural properties of conductive nitride films grown by plasma enhanced atomic layer deposition with significant ion bombardment effect
18Atomic layer deposition of Ta-based thin films: Reactions of alkylamide precursor with various reactants
19Trilayer Tunnel Selectors for Memristor Memory Cells
20Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
21Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
22Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
23Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
24Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
25The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
26Optical emission spectroscopy as a tool for studying, optimizing, and monitoring plasma-assisted atomic layer deposition processes
27Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
28The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
29Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
30Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
31Reaction mechanisms of atomic layer deposition of TaNx from Ta(NMe2)5 precursor and H2-based plasmas
32Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
33ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
34Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
35Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
36Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
37Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD