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TaNx Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing TaNx films returned 37 record(s).

NumberTitle
1High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
2Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
3The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
4Reaction mechanisms of atomic layer deposition of TaNx from Ta(NMe2)5 precursor and H2-based plasmas
5Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
6The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
7ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
8Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
9Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
10Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
11A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
12Optical emission spectroscopy as a tool for studying, optimizing, and monitoring plasma-assisted atomic layer deposition processes
13Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
14Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
15Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
16Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
17Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
18Electrical and structural properties of conductive nitride films grown by plasma enhanced atomic layer deposition with significant ion bombardment effect
19Atomic layer deposition of Ta-based thin films: Reactions of alkylamide precursor with various reactants
20Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
21Trilayer Tunnel Selectors for Memristor Memory Cells
22Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
23Ru thin film grown on TaN by plasma enhanced atomic layer deposition
24High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
25Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
26Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
27Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
28Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
29Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
30The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
31Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
32Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
33Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
34Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
35Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
36Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
37Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode