About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Trilayer Tunnel Selectors for Memristor Memory Cells

Type:
Journal
Info:
Adv. Mater. 2016 28(2) 356--362
Date:
2015-11-19

Author Information

Name Institution
Byung Joon ChoiSeoul National University of Science and Technology
Jiaming ZhangHewlett-Packard
Kate J. NorrisHewlett-Packard
Gary A. GibsonHewlett-Packard
Kyung Min KimHewlett-Packard
Warren JacksonHewlett-Packard
Min-Xian Max ZhangHewlett-Packard
Zhiyong LiHewlett-Packard
J. Joshua YangUniversity of Massachusetts, Amherst
R. Stanley WilliamsHewlett-Packard

Films

Plasma TaNx


Plasma TaNx


Plasma Ta2O5


Film/Plasma Properties

Characteristic: Unknown
Analysis: Four Terminal I-V

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Band Gap
Analysis: Optical Absorption

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: ELS, EELS, Electron Energy Loss Spectroscopy

Substrates

SiO2

Notes

550