Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
Info:
Journal of The Electrochemical Society, 155 (11) H885-H888 (2008)
Author Information
| Name |
Institution |
| Sung-Wook Kim | Korea Advanced Institute of Science and Technology |
| Se-Hun Kwon | Korea Advanced Institute of Science and Technology |
| Seong-Jun Jeong | Korea Advanced Institute of Science and Technology |
| Sang-Won Kang | Korea Advanced Institute of Science and Technology |
Films
Film/Plasma Properties
Analysis: SEM, Scanning Electron Microscopy
Analysis: TEM, Transmission Electron Microscope
Analysis: Electron Diffraction
Analysis: Four-point Probe
Analysis: XRD, X-Ray Diffraction
Analysis: AES, Auger Electron Spectroscopy
Analysis: RBS, Rutherford Backscattering Spectrometry
Substrates
Notes
| Investigated how Ru co-reactant impacts Ta phase |
| 1340 |