Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 42 record(s).

NumberTitle
1ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
2Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
3Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
4Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
5Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
6Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
7In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
8PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
9Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
10Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
11Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
12Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
13Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
14Ru thin film grown on TaN by plasma enhanced atomic layer deposition
15The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
16Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
17In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
18Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
19Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
20Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
21Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
22Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
23Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
24Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
25Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
26Texture of atomic layer deposited ruthenium
27Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
28Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
29Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
30Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
31A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
32Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
33(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
34Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
35Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
36Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
37Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
38Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
39Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
40Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
41Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
42Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition