Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


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Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 42 record(s).

NumberTitle
1Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
2Ru thin film grown on TaN by plasma enhanced atomic layer deposition
3Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
4Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
5Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
6Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
7Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
8Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
9Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
10Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
11Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
12Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
13Texture of atomic layer deposited ruthenium
14(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
15Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
16Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
17Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
18PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
19Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
20A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
21Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
22Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
23The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
24Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
25ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
26Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
27Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
28Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
29Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
30Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
31In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
32Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
33Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
34Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
35Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
36Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
37In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
38Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
39Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
40Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
41Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
42Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor