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Se-Hun Kwon Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Se-Hun Kwon returned 15 record(s).

NumberTitle
1Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
2Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
3Titanium oxynitride films for surface passivation of crystalline silicon deposited by plasma-enhanced atomic layer deposition to improve electrical conductivity
4Ultrathin effective TiN protective films prepared by plasma-enhanced atomic layer deposition for high performance metallic bipolar plates of polymer electrolyte membrane fuel cells
5Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode
6Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
7Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
8Growth of rutile-TiO2 thin films via Sn doping and insertion of ultra-thin SnO2 interlayer by atomic layer deposition
9Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
10Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
11PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
12Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
13Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
14Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
15Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition