Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
Author Information
| Name | Institution |
|---|---|
| Yong-Ping Wang | Fudan University |
| Zi-Jun Ding | Fudan University |
| Bao Zhu | Fudan University |
| Wen-Jun Liu | Fudan University |
| Shi-Jin Ding | Fudan University |
Films
Plasma TaNx
Film/Plasma Properties
Substrates
| Silicon |
Notes
| Paper text in Chinese, information derived from English abstract and figures. |
| Picosun system inferred from 3000W plasma levels. |
| 1266 |