About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects

Type:
Journal
Info:
ECS Transactions, 69 (7) 161-169 (2015)
Date:
2015-10-11

Author Information

Name Institution
Joyeeta NagIBM
Brian CohenIBM
Samuel ChoiIBM
Atsushi OginoIBM
Minseok OhIBM
Yan YanIBM
Jim LiangIBM
Cathryn ChristiansenIBM
Andrew KimIBM
Baozhen LiIBM
Patrick DeHavenIBM
Anita MadanIBM
Siddarth KrishnanIBM
Andrew H SimonIBM

Films

Plasma TaNx

Hardware used: Unknown


Thermal TaNx

Hardware used: Unknown


Film/Plasma Properties

Substrates

Notes

418