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Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper

Type:
Journal
Info:
Journal of The Electrochemical Society, 157 (2) G62-G66 (2010)
Date:
2009-10-01
DOI:
http://dx.doi.org/10.1149/1.3267881

Author Information

Name Institution
Chih-Chieh ChangNational Chiao Tung University
Fu-Ming PanNational Chiao Tung University
Ching-Wen ChenNational Chiao Tung University

Films

Plasma TaNx

Hardware used: Custom
TaCl5, Tantalum Pentachloride
CAS#: 7721-01-9
H2, Hydrogen
CAS#: 1333-74-0
N2, Nitrogen
CAS#: 7727-37-9
Deposition Temperature = 300C

Film/Plasma Properties

Characteristic: Adhesion
Analysis: Bending Test, Four Point Bend Delamination Test
Diagnostic: -

Characteristic: Adhesion
Analysis: Pull-off tensile test
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: JEOL JSM-6500F

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Digital Instruments Nanoscope E

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Thermo VG 350

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Diagnostic: -

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Technai F20

Substrates

SiO2
Si(100)

Notes

722