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Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum

Type:
Journal
Info:
Journal of The Electrochemical Society, 157 (6) H652-H656 (2010)
Date:
2009-12-09

Author Information

Name Institution
Suk-Hoon KimPohang University of Science and Technology (POSTECH)
Moon-Kyun SongPohang University of Science and Technology (POSTECH)
Shi-Woo RheePohang University of Science and Technology (POSTECH)

Films

Thermal TaCN


Plasma TaCN


Thermal TaNx


Plasma TaNx


Thermal TaCx


Plasma TaCx


Film/Plasma Properties

Characteristic: Deposition Kinetics, Reaction Mechanism
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Gas Phase Species
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Substrates

SiO2

Notes

721