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Electrical and structural properties of conductive nitride films grown by plasma enhanced atomic layer deposition with significant ion bombardment effect

Type:
Journal
Info:
Journal of Applied Physics 128, 065301 (2020)
Date:
2020-07-24
DOI:
http://dx.doi.org/10.1063/5.0015961

Author Information

Name Institution
Igor KrylovTower Semiconductor Ltd.
Valentina KorchnoyTechnion-Israel Institute of Technology
Xianbin XuTechnion-Israel Institute of Technology
Kamira WeinfeldTechnion-Israel Institute of Technology
Eilam YalonTechnion-Israel Institute of Technology
Dan RitterTechnion-Israel Institute of Technology
Moshe EizenbergTechnion-Israel Institute of Technology

Films

Plasma TiN

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TDMATi, tetrakis(dimethylamido)titanium, titanium dimethylamide, (Me2N)4Ti
CAS#: 3275-24-9
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 300C

Plasma ZrN

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TEMAZr, (EtMeN)4Zr, [(C2H5)(CH3)N]4Zr, Tetrakis(EthylMethylAmido) Zirconium, Zirconium Ethylmethylamide
CAS#: 175923-04-3
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 300C

Plasma HfNx

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TDMAHf, tetrakis(dimethylamido)hafnium, hafnium dimethylamide, (Me2N)4Hf, also CAS# 19782-68-4
CAS#: 19962-11-9
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 300C

Plasma HfNx

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TDMAHf, tetrakis(dimethylamido)hafnium, hafnium dimethylamide, (Me2N)4Hf, also CAS# 19782-68-4
CAS#: 19962-11-9
NH3, Ammonia
CAS#: 7664-41-7
Deposition Temperature = 300C

Plasma TaNx

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
PDMAT, (NMe2)5Ta, Pentakis (DiMethylAmido) Tantalum
CAS#: 19824-59-0
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 300C

Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Custom
Diagnostic: Custom

Characteristic: TCR, Temperature Coefficient of Resistivity
Analysis: Custom
Diagnostic: Custom

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Diagnostic: Rigaku Smartlab

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Diagnostic: Rigaku Smartlab

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: Rigaku Smartlab

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: PHI Versaprobe III

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Helios Nanolab600

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Helios Nanolab600

Substrates

SiO2

Notes

1594