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Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 41 record(s).

NumberTitle
1Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
2Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
3Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
4Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
5Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
6Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
7Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
8A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
9Ru thin film grown on TaN by plasma enhanced atomic layer deposition
10The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
11Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
12Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
13Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
14TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
15Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
16Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
17Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
18Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
19Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
20Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
21Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
22Atomic layer deposition of titanium nitride from TDMAT precursor
23Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
24Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
25An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
26Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
27Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
28Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
29Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
30Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
31Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
32Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
33Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
34Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
35Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
36The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
37Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
38Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
39Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
40Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
41From Precursor Chemistry to Gas Sensors: Plasma-Enhanced Atomic Layer Deposition Process Engineering for Zinc Oxide Layers from a Nonpyrophoric Zinc Precursor for Gas Barrier and Sensor Applications