Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
Info:
Thin Solid Films 685 (2019) 393 - 401
Author Information
Films
Film/Plasma Properties
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XRD, X-Ray Diffraction
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: Electron Diffraction
Analysis: TEM, Transmission Electron Microscope
Analysis: TEM, Transmission Electron Microscope
Analysis: Scanning Kelvin Probe Microscopy (SKPM)
Analysis: XRD, X-Ray Diffraction
Analysis: Four-point Probe
Analysis: Four-point Probe
Substrates
Notes