About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor

Type:
Journal
Info:
J. Mater. Chem. C, 2016
Date:
2015-12-20
DOI:
http://dx.doi.org/10.1039/C5TC03385C

Author Information

Name Institution
Maximilian GebhardRuhr-University Bochum
Felix MitschkerRuhr-University Bochum
M. WiesingUniversity of Paderborn
I. GinerUniversity of Paderborn
B. TorunUniversity of Paderborn
Teresa de los ArcosUniversity of Paderborn
Peter AwakowiczRuhr-University Bochum
G. GrundmeierUniversity of Paderborn
Anjana DeviRuhr-University Bochum

Films

Plasma TiO2

Hardware used: Custom Direct Capacitively Coupled Plasma
tris(dimethylamido)-(dimethylamino-2-propanolato)titanium(IV) (TDMADT)
CAS#: 0-0-0
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 60C

Film/Plasma Properties

Characteristic: Surface Reactions
Analysis: QCM, Quartz Crystal Microbalance
Diagnostic: Inficon

Characteristic: Thickness
Analysis: QCM, Quartz Crystal Microbalance
Diagnostic: Inficon

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: JPK Nanowizard III Ultra

Characteristic: Diffusion Barrier Properties
Analysis: Oxygen Transmission Rate (OTR)
Diagnostic: Mocon OX-TRAN 2/61

Characteristic: Precursor Characterization
Analysis: NMR, Nuclear Magnetic Resonance
Diagnostic: Bruker Avance DPX 200

Characteristic: Precursor Characterization
Analysis: TGA, Thermo Gravimetric Analysis
Diagnostic: Seiko TG/DTA 6200/SII

Characteristic: Thickness
Analysis: Reflectometry
Diagnostic: Filmetrics

Characteristic: Refractive Index
Analysis: Reflectometry
Diagnostic: Filmetrics

Characteristic: Extinction Coefficient
Analysis: Reflectometry
Diagnostic: Filmetrics

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: NRA, Nuclear Reaction Analysis
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Omicron ESCA+

Substrates

Si(100)
PET, Polyethylene Terephthalate

Notes

471