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Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices

Type:
Conference Proceedings
Info:
2013 Transducers & Eurosensors XXVII: The 17th International Conference on 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)
Date:
2013-06-13
DOI:
http://dx.doi.org/10.1109/Transducers.2013.6626949

Author Information

Name Institution
Xianzong XieUniversity of Utah
Loren RiethUniversity of Utah
Prashant TathireddyUniversity of Utah
Florian SolzbacherUniversity of Utah

Films

Plasma Al2O3

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 120C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam VASE

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: -

Characteristic: Diffusion Barrier Properties
Analysis: I-V, Current-Voltage Measurements
Diagnostic: -

Characteristic: Diffusion Barrier Properties
Analysis: EIS, Electrochemical Impedance Spectroscopy
Diagnostic: -

Substrates

Au

Notes

See on-line thesis.
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