Influence of the Deposition Temperature on the c-Si Surface Passivation by Al2O3 Films Synthesized by ALD and PECVD
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 13(3) H76-H79 (2010)
Date:
2009-11-30
Author Information
Name | Institution |
---|---|
Gijs Dingemans | Eindhoven University of Technology |
Mauritius C. M. (Richard) van de Sanden | Eindhoven University of Technology |
Erwin (W.M.M.) Kessels | Eindhoven University of Technology |
Films
Plasma Al2O3
Thermal Al2O3
Plasma Al2O3
Thermal Al2O3
Film/Plasma Properties
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Surface Recombination Velocity
Analysis: Lifetime Testing
Substrates
Si(100) |
Notes
Plasma and thermal ALD Al2O3 Oxford Instruments FlexAL and OpAL study for silicon PV passivation. |
187 |