Atomic layer deposited HfO2/HfSixOyNz stacked gate dielectrics for metal-oxide-semiconductor structures
Type:
Journal
Info:
J. Vac. Sci. Technol. B 25(6) Nov/Dec 2007
Date:
2007-10-22
Author Information
Name | Institution |
---|---|
Seokhoon Kim | Hanyang University |
Sanghyun Woo | Hanyang University |
Hyungchul Kim | Hanyang University |
Wooho Jeong | Hanyang University |
Taeyong Park | Hanyang University |
Honggyu Kim | Hanyang University |
Sung Bae Kim | Hanyang University |
Hyeongtag Jeon | Hanyang University |
Films
Plasma HfO2
Plasma HfSiON
Hardware used: Custom Direct Capacitively Coupled Plasma
CAS#: 19824-55-6
CAS#: 7727-37-9
CAS#: 7782-44-7
Film/Plasma Properties
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Effective Oxide Charge, Qeff
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
Si(100) |
HfSiON |
Notes
1184 |