About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

The Influence of Ions and Photons during Plasma-Assisted ALD of Metal Oxides

Type:
Conference Proceedings
Info:
ECS Transactions, 33 (2) 61-67 (2010)
Date:
2010-07-08

Author Information

Name Institution
H. B. ProfijtEindhoven University of Technology
P. KudlacekEindhoven University of Technology
Mauritius C. M. (Richard) van de SandenEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology

Films

Plasma Al2O3


Plasma Al2O3


Film/Plasma Properties

Characteristic: Ion Energy
Analysis: RFEA, Retarding Field Energy Analyzer

Characteristic: Ion Flux
Analysis: RFEA, Retarding Field Energy Analyzer

Characteristic: Ion Flux
Analysis: Custom

Characteristic: Electron Temperature, Te
Analysis: Langmuir Probe

Characteristic: Electron Density, ne
Analysis: Langmuir Probe

Characteristic: Gas Phase Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Gas Phase Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Minority Carrier Lifetime
Analysis: Photoconductance

Substrates

Silicon

Notes

718