Publication Information

Title:
Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approach
Type:
Conference Proceedings
Info:
Proc. SPIE 9428, Advanced Etch Technology for Nanopatterning IV
Date:
2015-02-22

Author Information

Name Institution
E. DupuyCEA - Grenoble
E. PargonCEA - Grenoble
M. FouchierCEA - Grenoble
H. GrampeixCEA - Grenoble
J. PradellesCEA - Grenoble
Maxine DarnonCEA - Grenoble
P. Pimenta-BarrosCEA - Grenoble
S. BarnolaCEA - Grenoble
Olivier JoubertCEA - Grenoble

Films

Plasma SiO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Substrates

Keywords

Notes

532