About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Hydrogen radical enhanced atomic layer deposition of TaOx: saturation studies and methods for oxygen deficiency control

Type:
Journal
Info:
J. Mater. Chem. C, 2018, 6, 9667-9674
Date:
2018-08-14

Author Information

Name Institution
Konstantin V. EgorovMoscow Institute of Physics and Technology
Dmitry S. KuzmichevMoscow Institute of Physics and Technology
Andrey A. SigarevMoscow Institute of Physics and Technology
Denis I. MyakotaMoscow Institute of Physics and Technology
Sergey S. ZarubinMoscow Institute of Physics and Technology
Pavel S. ChizovMoscow State University
Timofey V. PerevalovRzhanov Institute of Semiconductor Physics SB RAS
Vladimir A. GritsenkoRzhanov Institute of Semiconductor Physics SB RAS
Cheol Seong HwangSeoul National University
Andrey M. MarkeevMoscow Institute of Physics and Technology

Films

Plasma Ta2O5

Hardware used: Picosun R200


CAS#: 1333-74-0

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Unknown
Analysis: XRR, X-Ray Reflectivity

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Band Gap
Analysis: REELS, Reflection Electron Energy Loss Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Substrates

Si with native oxide

Notes

1286