Publication Information

Title:
A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD
Type:
Journal
Info:
Plasma Proc Polymers
Date:
2018-02-25

Author Information

Name Institution
Maximilian GebhardRuhr-University Bochum
Felix MitschkerRuhr-University Bochum
Christian HoppeUniversity of Paderborn
Morteza AghaeeEindhoven University of Technology
Detlef RogallaRuhr-University Bochum
Mariadriana CreatoreEindhoven University of Technology
G. GrundmeierUniversity of Paderborn
P. AwakowiczRuhr-University Bochum
Anjana DeviRuhr-University Bochum

Films

Plasma SiO2


Plasma Al2O3


Film/Plasma Properties

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Oxygen Transmission Rate (OTR)
Analysis: -

Characteristic: Damage, Defects
Analysis: -

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Porosity
Analysis: -

Substrates

Si(100)
PET, Polyethylene Terephthalate

Keywords

Seed Layer
Diffusion Barrier

Notes

1108