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Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition
Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2021, 13 (18), pp 21905-21913
Date:
2021-03-12
Author Information
| Name | Institution |
|---|---|
| Heungdong Kwon | Stanford University |
| Christopher Perez | Stanford University |
| Hyojin K. Kim | Stanford University |
| Mehdi Asheghi | Stanford University |
| Woosung Park | Sookmyung Women's University |
| Kenneth E. Goodson | Stanford University |
Films
Plasma TiO2
Plasma Al2O3
Plasma Pt
Film/Plasma Properties
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Thermal Boundary Resistance
Analysis: TDTR, Time-Domain ThermoReflectance
Substrates
| Si(100) |
Notes
| 1614 |