Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2021, 13 (18), pp 21905-21913
Date:
2021-03-12

Author Information

Name Institution
Heungdong KwonStanford University
Christopher PerezStanford University
Hyojin K. KimStanford University
Mehdi AsheghiStanford University
Woosung ParkSookmyung Women's University
Kenneth E. GoodsonStanford University

Films


Plasma Al2O3



Film/Plasma Properties

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Thermal Boundary Resistance
Analysis: TDTR, Time-Domain ThermoReflectance

Substrates

Si(100)

Keywords

Notes

1614