Plasma-Assisted Atomic Layer Deposition of Low Temperature SiO2
Type:
Journal
Info:
ECS Transactions, 35 (4) 191-204 (2011)
Date:
2011-05-03
Author Information
Name | Institution |
---|---|
Gijs Dingemans | Eindhoven University of Technology |
Cristian Van Helvoirt | Eindhoven University of Technology |
Mauritius C. M. (Richard) van de Sanden | Eindhoven University of Technology |
Erwin (W.M.M.) Kessels | Eindhoven University of Technology |
Films
Plasma SiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope
Characteristic: Gas Phase Species
Analysis: QMS, Quadrupole Mass Spectrometer
Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy
Characteristic: Minority Carrier Lifetime
Analysis: Lifetime Testing
Substrates
Notes
354 |