Plasma-Assisted Atomic Layer Deposition of Low Temperature SiO2

Type:
Journal
Info:
ECS Transactions, 35 (4) 191-204 (2011)
Date:
2011-05-03

Author Information

Name Institution
Gijs DingemansEindhoven University of Technology
Cristian Van HelvoirtEindhoven University of Technology
Mauritius C. M. (Richard) van de SandenEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology

Films

Plasma SiO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope

Characteristic: Gas Phase Species
Analysis: QMS, Quadrupole Mass Spectrometer

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Minority Carrier Lifetime
Analysis: Lifetime Testing

Substrates

Notes

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