Adhesion Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Adhesion returned 30 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
2Atomic Layer Deposition of NiO to Produce Active Material for Thin-Film Lithium-Ion Batteries
3Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
4Photocatalytic functional coatings of TiO2 thin films on polymer substrate by plasma enhanced atomic layer deposition
5Designing Multifunctional Cobalt Oxide Layers for Efficient and Stable Electrochemical Oxygen Evolution
6Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
7Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
8Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
9Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
10Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
11Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
12PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
13Capacitance spectroscopy of gate-defined electronic lattices
14Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
15Copper-ALD Seed Layer as an Enabler for Device Scaling
16Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
17Ultra-Thin Aluminium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition for Corrosion Protection
18High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
19Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors
20In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
21Hydrogen plasma-enhanced atomic layer deposition of copper thin films
22Mechanical properties of thin-film Parylene-metal-Parylene devices
23Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
24Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
25Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
26Antireflection Coating on PMMA Substrates by Atomic Layer Deposition
27Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
28Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
29Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
30Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces