Publication Information

Title: Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper

Type: Journal

Info: Journal of The Electrochemical Society, 157 (2) G62-G66 (2010)

Date: 2009-10-01

DOI: http://dx.doi.org/10.1149/1.3267881

Author Information

Name

Institution

National Chiao Tung University

National Chiao Tung University

National Chiao Tung University

Films

Plasma TaNx using Custom

Deposition Temperature = 300C

7721-01-9

1333-74-0

7727-37-9

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Adhesion

Bending Test, Four Point Bend Delamination Test

Unknown

Adhesion

Pull-off tensile test

Unknown

Morphology, Roughness, Topography

SEM, Scanning Electron Microscopy

JEOL JSM-6500F

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Digital Instruments Nanoscope E

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

Thermo VG 350

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

Unknown

Microstructure

TEM, Transmission Electron Microscope

FEI Technai F20

Substrates

SiO2

Si(100)

Keywords

Adhesion

Interconnect

Notes

722

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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