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Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 5 (6) C64-C66 (2002)
Date:
2002-02-22
Author Information
| Name | Institution |
|---|---|
| Junghun Chae | Korea Advanced Institute of Science and Technology |
| Hyoung-Sang Park | Genitech Co., Ltd. |
| Sang-Won Kang | Korea Advanced Institute of Science and Technology |
Films
Other Ni
Thermal NiOx
Plasma Ni
Film/Plasma Properties
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Adhesion
Analysis: Tape Test
Substrates
| TiN |
Notes
| Direct NiCp2 + H2 plasma resulted in non-metallic powder |
| 1187 |