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Hydrogen plasma-enhanced atomic layer deposition of copper thin films
Type:
Journal
Info:
J. Vac. Sci. Technol. B 25(6), Nov/Dec 2007
Date:
2007-12-11
Author Information
| Name | Institution |
|---|---|
| Liqi Wu | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Plasma Cu
Film/Plasma Properties
Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Continuity
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Characteristic: Adhesion
Analysis: Tape Test
Substrates
| TaN |
| Ru |
| SiO2 |
Notes
| 38 |