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High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
Type:
Conference Proceedings
Info:
High-k oxides by ALD, At Wrocław, Poland
Date:
2018-03-01
Author Information
| Name | Institution |
|---|---|
| Sebastian Killge | Technische Universität Dresden |
| Johanna Reif | Technische Universität Dresden |
| Volker Neumann | Technische Universität Dresden |
| Marcel Junige | University of Colorado, Boulder |
| Marion Geidel | Technische Universität Dresden |
| Christian Wenzel | Technische Universität Dresden |
| Martin Knaut | Technische Universität Dresden |
| Matthias Albert | Technische Universität Dresden |
| Johann W. Bartha | Technische Universität Dresden |
Films
Thermal Ru
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Adhesion
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Substrates
| SiO2 |
Notes
| 1281 |