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Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
Type:
Journal
Info:
Journal of Electroceramics, v. 36, n. 1, p. 165--169 (2016)
Date:
2016-01-25
Author Information
| Name | Institution |
|---|---|
| Ha-Jin Lee | Pusan National University |
| Jin-Seong Park | Hanyang University |
| Se-Hun Kwon | Pusan National University |
Films
Film/Plasma Properties
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Microstructure
Analysis: XRD, X-Ray Diffraction
Characteristic: Adhesion
Analysis: Tape Test
Characteristic: Diffusion Barrier Properties
Analysis: Anneal
Substrates
| SiO2 |
Notes
| 771 |