Plasma-Assisted Atomic Layer Deposition of Palladium

Type:
Journal
Info:
Chem. Vap. Deposition 2005, 11, No. 1
Date:
2004-06-01

Author Information

Name Institution
Gregory A. Ten EyckRensselaer Polytechnic Institute (RPI)
Jay J. SenkevichRensselaer Polytechnic Institute (RPI)
Fu TangRensselaer Polytechnic Institute (RPI)
Deli LiuRensselaer Polytechnic Institute (RPI)
Samuk PimanpangRensselaer Polytechnic Institute (RPI)
Tansel KarabackRensselaer Polytechnic Institute (RPI)
Gwo-Ching WangRensselaer Polytechnic Institute (RPI)
Toh-Ming LuRensselaer Polytechnic Institute (RPI)
Christopher JezewskiState University of New York at Albany
W. A. LanfordState University of New York at Albany

Films


Film/Plasma Properties

Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: RHEED, Reflection High-Energy Electron Diffraction

Substrates

Silicon
W
Ir

Notes

1179