Growth behavior and film properties of titanium dioxide by plasma-enhanced atomic layer deposition with discrete feeding method

Type:
Journal
Info:
AIP ADVANCES 9, 035333 (2019)
Date:
2019-03-09

Author Information

Name Institution
Heungseop SongYonsei University
Donghyuk ShinYonsei University
Ji-eun JeongYonsei University
Heungsoo ParkYonsei University
Dae-Hong KoYonsei University

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Wet Etch Resistance
Analysis: Custom

Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements

Substrates

SiO2

Notes

1284