Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Moisture barrier properties of thin organic-inorganic multilayers prepared by plasma-enhanced ALD and CVD in one reactor

Type:
Journal
Info:
Nanoscale Research Letters 2014, 9:223
Date:
2014-04-11
DOI:
http://dx.doi.org/10.1186/1556-276X-9-223

Author Information

Name Institution
Tim BulowTechnische Universität Braunschweig
Hassan GargouriSentech Instruments GmbH
Mirko SiebertSentech Instruments GmbH
Rolf RudolphSentech Instruments GmbH
Hans-Hermann JohannesTechnische Universität Braunschweig
Wolfgang KowalskyTechnische Universität Braunschweig

Films

Plasma Al2O3

Hardware used: SENTECH
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 80C

Film/Plasma Properties

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test
Diagnostic: Custom

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Diagnostic: JEOL JSM-6400

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: Semilab GES5

Characteristic: Refractive Index
Analysis: Ellipsometry
Diagnostic: Semilab GES5

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: DME DualScope DS 45-40

Substrates

PEN, Polyethylene Napthalate

Notes

218