Comparisons of alumina barrier films deposited by thermal and plasma atomic layer deposition

Type:
Journal
Info:
Materials Today Chemistry 11 (2019) 8-15
Date:
2018-10-03
DOI:
https://doi.org/10.1016/j.mtchem.2018.10.002

Author Information

Name Institution
Karyn L. JarvisAustralian Nuclear Science and Technology Organisation
Peter J. EvansAustralian Nuclear Science and Technology Organisation
A. NelsonAustralian Nuclear Science and Technology Organisation
Gerry TrianiAustralian Nuclear Science and Technology Organisation

Films

Thermal Al2O3

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Where to buy precursor
H2O, Water
CAS#: 7732-18-5
Deposition Temperature Range = 100-120C

Plasma Al2O3

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature Range = 100-120C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam M-2000DI

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Custom
Diagnostic: Custom

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Digital Instrument D3000

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Thermo Scientific ESCA LAB 250 XPS Spectrometer

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Diagnostic: PANalytical Xpert PRO MPD X-ray Diffractometer

Substrates

PET, Polyethylene Terephthalate
Silicon

Notes

1218