Effect of rapid thermal annealing on the mechanical stress and physico-chemical properties in plasma enhanced atomic layer deposited silicon nitride thin films
Type:
Journal
Info:
J. Vac. Sci. Technol. B 40(5) Sep/Oct 2022
Date:
2022-07-06
Author Information
| Name | Institution |
|---|---|
| Antony Premkumar Peter | IMEC |
| Alfonso Sepulveda Marquez | IMEC |
| Johan Meersschaut | IMEC |
| Praveen Dara | IMEC |
| Timothee Blanquart | ASM Belgium |
| Takayama Tomomi | ASM Japan |
| Ebisudani Taishi | ASM Japan |
| Shiba Elichiro | ASM Japan |
| Yosuke Kimura | IMEC |
| Sander van Gompel | IMEC |
| Pierre Morin | IMEC |
Films
Plasma SiNx
Plasma SiNx
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Uniformity
Analysis: Ellipsometry
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Mass Gain
Analysis: -
Characteristic: Chemical Binding
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Characteristic: Wet Etch Resistance
Analysis: -
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Substrates
| Silicon |
Notes
| Silicon precursor not explicitly stated, inferred from references. |
| 1745 |