Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Fiber-matrix interface reinforcement using Atomic Layer Deposition

Type:
Journal
Info:
mrsf12-1499-n05-173
Date:
2013-04-15
DOI:
http://dx.doi.org/10.1557/opl.2013.536

Author Information

Name Institution
Sari KatzSoreq NRC
Yacov CarmielBar Ilan University
Irina GouzmanSoreq NRC
Chaim N. SukenikBar Ilan University
Hanoch D. WagnerWeizmann Institute of Science
Eitan GrossmanSoreq NRC

Films

Thermal Al2O3

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Where to buy precursor
H2O, Water
CAS#: 7732-18-5
Where to buy precursor
Deposition Temperature = 80C

Other Al2O3

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Where to buy precursor
H2O, Water
CAS#: 7732-18-5
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 80C

Film/Plasma Properties

Substrates

Polyethylene

Notes

O2 plasma pretreatment used to increase surface reactivity for thermal Al2O3 deposition
1368