ALD and PEALD deposition of HfO2 and its effects on the nature of oxygen vacancies

Type:
Journal
Info:
Materials Science and Engineering B 285 (2022) 115964
Date:
2022-08-17

Author Information

Name Institution
M.A. Martí­nez-PuenteCIMAV - Center for Research in Advanced Materials
P. HorleyCIMAV - Center for Research in Advanced Materials
F.S. Aguirre-TostadoCIMAV - Center for Research in Advanced Materials
J. López-MedinaNational Autonomous University of Mexico
H.A. Bórbon-NuñezNational Autonomous University of Mexico
H. TiznadoNational Autonomous University of Mexico
A. Susarrey-ArceUniversity of Twente
E. Martí­nez-GuerraCIMAV - Center for Research in Advanced Materials

Films



Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Optical Band Edge
Analysis: UV-VIS Spectroscopy

Substrates

Si(100)

Notes

Compared plasma process with and without ion bombardment by using grounded grid between plasma source and substrate.
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