About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Conformality of remote plasma-enhanced atomic layer deposition processes: An experimental study

Type:
Journal
Info:
J. Vac. Sci. Technol. A 30(1), Jan/Feb 2012
Date:
2011-10-19

Author Information

Name Institution
Maarit I. KariniemiUniversity of Helsinki
Jaakko T. NiinistöUniversity of Helsinki
Marko VehkamäkiUniversity of Helsinki
Marianna KemellUniversity of Helsinki
Mikko K. RitalaUniversity of Helsinki
Markku A. LeskeläUniversity of Helsinki
Matti PutkonenBeneq Oy

Films

Plasma SiO2


Plasma HfO2


Plasma Al2O3


Plasma TiO2


Plasma Ta2O5

Hardware used: Beneq TFS-200


CAS#: 7782-44-7


Film/Plasma Properties

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Substrates

Silicon
SiO2
TiN

Notes

Aeronex GateKeeper and Entegris GateKeeper gas purifiers used.
Beneq TFS-200 study on high aspect ratio conformality of SiO2, HfO2, Al2O3, TiO2, Ta2O5, and Ag PEALD films.
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