Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Evaluation of Vapor Deposition Techniques for Membrane Pore Size Modification

Type:
Journal
Info:
Journal of Membrane Science and Research 3 (2017) 64--70
Date:
2016-06-26
DOI:
http://dx.doi.org/10.22079/jmsr.2016.20345

Author Information

Name Institution
Sanket KelkarColorado School of Mines
Colin A. WoldenColorado School of Mines

Films

Plasma TiO2

Hardware used: Custom
TiCl4, Titanium Tetrachloride
CAS#: 7550-45-0
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 70C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam VASE

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: JEOL JSM-7000F

Substrates

Polycarbonate
Isopore

Notes

990