Area selective deposition of TiO2 by intercalation of plasma etching cycles in PEALD process: A bottom up approach for the simplification of 3D integration scheme
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 37, 020918 (2019)
Date:
2019-01-17
Author Information
Name | Institution |
---|---|
Rémi Vallat | Grenoble Alps University (UGA) |
Rémy Gassilloud | CEA - LETI MINATEC |
Olivier Salicio | Grenoble Alps University (UGA) |
Khalil El-Hajjam | CEA - LETI MINATEC |
Gabriel Molas | CEA - LETI MINATEC |
Bernard Pelissier | Grenoble Alps University (UGA) |
Christophe Vallée | Grenoble Alps University (UGA) |
Films
Plasma TiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Etch Rate
Analysis: Custom
Substrates
Silicon |
SiO2 |
SiF |
SiOF |
TiN |
Notes
1248 |