Area selective deposition of TiO2 by intercalation of plasma etching cycles in PEALD process: A bottom up approach for the simplification of 3D integration scheme
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 37, 020918 (2019)
Date:
2019-01-17
Author Information
| Name | Institution |
|---|---|
| Rémi Vallat | Grenoble Alps University (UGA) |
| Rémy Gassilloud | CEA - LETI MINATEC |
| Olivier Salicio | Grenoble Alps University (UGA) |
| Khalil El-Hajjam | CEA - LETI MINATEC |
| Gabriel Molas | CEA - LETI MINATEC |
| Bernard Pelissier | Grenoble Alps University (UGA) |
| Christophe Vallée | Grenoble Alps University (UGA) |
Films
Plasma TiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Etch Rate
Analysis: Custom
Substrates
| Silicon |
| SiO2 |
| SiF |
| SiOF |
| TiN |
Notes
| 1248 |