About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Atomic Layer Deposition of Aluminum Phosphate Based on the Plasma Polymerization of Trimethyl Phosphate

Type:
Journal
Info:
Chem. Mater., 2014, 26 (23), pp 6863-6871
Date:
2014-11-14

Author Information

Name Institution
Thomas DobbelaereGhent University

Films

Plasma AlPxOy


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: OES
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Gas Phase Species
Analysis: QMS, Quadrupole Mass Spectrometer

Characteristic: Gas Phase Species
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Substrates

Silicon

Notes

Available as chapter 3 in on-line thesis: Plasma-enhanced atomic layer deposition of transition metal phosphates
240