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Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Atomic layer deposition of LiF using LiN(SiMe3)2 and SF6 plasma

Type:
Journal
Info:
Phys. Chem. Chem. Phys., 2021, 23, 9304-9314
Date:
2021-03-28

Author Information

Name Institution
Norah HornsveldEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology
R. A. SynowickiJ.A. Woollam Co., Inc.
Mariadriana CreatoreEindhoven University of Technology

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Extinction Coefficient
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis

Characteristic: Chemical Composition, Impurities
Analysis: EBS, Elastic Backscattering

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Gas Phase Species
Analysis: QMS, Quadrupole Mass Spectrometer

Substrates

Si(100)

Notes

1562