Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Atomic Layer Deposition of Nanolayered Carbon Films

Type:
Journal
Info:
C 2021, 7, 67.
Date:
2021-09-24
DOI:
http://dx.doi.org/10.3390/c7040067

Author Information

Name Institution
Zhigang XiaoAlabama A&M University
Kim KisslingerBrookhaven National Laboratory
Rebhadevi MonikandanGeorgia Institute of Technology

Films

Plasma C

Hardware used: Kurt J Lesker ALD-150LX
CH4, Methane
CAS#: 74-82-8
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H2, Hydrogen
CAS#: 1333-74-0

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Ar, Argon
CAS#: 7440-37-1
Deposition Temperature = 500C

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Thermo Scientific K-Alpha

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: FEI Helios Nanolab600

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: JEOL 2100F

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Diagnostic: FEI Talos F200X

Characteristic: Raman Spectra
Analysis: Raman Spectroscopy
Diagnostic: Renishaw Invia Raman

Substrates

Cu

Notes

1622