About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Plasma enhanced atomic layer deposition of gallium oxide on crystalline silicon: demonstration of surface passivation and negative interfacial charge

Type:
Journal
Info:
physica status solidi (RRL) - Rapid Research Letters Volume 9, Issue 4, pages 220--224, 2015
Date:
2015-03-23

Author Information

Name Institution
Thomas G. AllenThe Australian National University
Andres CuevasThe Australian National University

Films

Plasma Ga2O3

Hardware used: Beneq TFS-200


CAS#: 7782-44-7

Film/Plasma Properties

Characteristic: Lifetime
Analysis: Photoconductance

Characteristic: Surface Recombination Velocity
Analysis: Photoconductance

Characteristic: Fixed Charge Density
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Surface Defect Density
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Optical Bandgap
Analysis: Optical Transmission

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Microstructure
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Substrates

Si(100)

Notes

518