About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Breakdown and Protection of ALD Moisture Barrier Thin Films

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2015, 7 (40), pp 22121-22127
Date:
2015-09-24

Author Information

Name Institution
Frederik NehmTechnische Universität Dresden
Hannes KlumbiesTechnische Universität Dresden
Claudia RichterNaMLab gGmbH
Aarti SinghNaMLab gGmbH
Uwe SchroederNaMLab gGmbH
Thomas MikolajickNaMLab gGmbH
Tobias MönchTechnische Universität Dresden
Christoph HoßbachTechnische Universität Dresden
Matthias AlbertTechnische Universität Dresden
Johann W. BarthaTechnische Universität Dresden
Karl LeoTechnische Universität Dresden
Lars Müller-MeskampTechnische Universität Dresden

Films

Thermal Al2O3


Thermal TiO2

Hardware used: Beneq TFS-500


CAS#: 7732-18-5

Thermal Alucone


Thermal HfO2


Plasma SiO2


Plasma Al2O3


Film/Plasma Properties

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Substrates

Glass
Calcium

Notes

396