Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Initiation of atomic layer deposition of metal oxides on polymer substrates by water plasma pretreatment

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 30, 01A137 (2012)
Date:
2011-10-31
DOI:
http://dx.doi.org/10.1116/1.3666026

Author Information

Name Institution
E. Steven BrandtEastman Kodak Company
Jeremy M. GraceEastman Kodak Company

Films

Other Al2O3

Hardware used: Custom
DMAI, dimethylaluminum isopropoxide, Me2Al(O-i-Pr)3
CAS#: 6063-89-4
Where to buy precursor
H2O, Water
CAS#: 7732-18-5
Where to buy precursor
Deposition Temperature Range = 75-100C

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Thermo Scientific ESCA LAB 250 XPS Spectrometer

Substrates

Polystyrene
Polypropylene
Polyvinylalcohol
PEN, Polyethylene Napthalate

Notes

Prepped polymer surfaces with H2O plasma prior to thermal ALD process.
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