Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.



Characteristics of Plasma-Enhanced Atomic-Layer Deposited (PEALD) SnO2 Thin Films

Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 46, No. 4, April 2005, pp. L756-L759
Date:
2005-02-01
DOI:
No DOI

Author Information

Name Institution
Woonyoung LeeChonnam National University
Yongkook ChoiChonnam National University
Kwangjun HongChosun University
Nam-Hoon KimChosun University
Yongju ParkChosun University
Jin-Seong ParkChosun University

Films

Plasma SnO2


Film/Plasma Properties

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Thickness
Analysis: Ellipsometry

Substrates

Si(100)

Notes

Films annealed.
122