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An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Layer-controlled and atomically thin WS2 films prepared by sulfurization of atomic-layer-deposited WO3 films

Type:
Journal
Info:
Journal of Alloys and Compounds, Volume 745, 2018, Pages 834-839
Date:
2018-02-05

Author Information

Name Institution
Wei ZengNorthwestern Polytechnical University
Li-ping FengNorthwestern Polytechnical University
Jie SuNorthwestern Polytechnical University
Hai-xi PanNorthwestern Polytechnical University
Zheng-tang LiuNorthwestern Polytechnical University

Films

Plasma WO3


Film/Plasma Properties

Characteristic: Thickness
Analysis: -

Substrates

SiO2

Notes

1710