Highly-Conformal Amorphous W-Si-N Thin Films by Plasma Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization
Type:
Journal
Info:
J. Phys. Chem. C, 2015, 119 (3), pp 1548-1556
Date:
2014-12-29
Author Information
| Name | Institution |
|---|---|
| Soo-Hyun Kim | Yenunnam University |
Films
Plasma WSiN
Film/Plasma Properties
Substrates
Notes
| 228 |