Publication Information

Title: Highly-Conformal Amorphous W-Si-N Thin Films by Plasma Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization

Type: Journal

Info: J. Phys. Chem. C, 2015, 119 (3), pp 1548-1556

Date: 2014-12-29

DOI: http://dx.doi.org/10.1021/jp510226g

Author Information

Name

Institution

Yenunnam University

Films

Deposition Temperature = 300C

0-0-0

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

Keywords

Notes

228



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